分类 Design 下的文章

Test Latex Support

\section{Bar-Cohen and Rohsennow Solution} Finned surfaces of various shap...

NATURAL CONVECTION:NATURAL CONVECTION FROM FINNED SURFACES AND PCBs

Natural convection flow through a channel formed by two parallel plates as sh...

Thermal Resistance Comparison Of Graphite Foam, Aluminum, And Copper Heat Sinks

IntroductionWith thermal solutions becoming more challenging, there is a push...

Fan Efficiency, An Increasingly Important Selection Criteria

The Importance of Fan EfficiencyWhy is fan efficiency so important? As a gene...

Thermal Analysis of a Low Noise Amplifier

LNA Design Series - part 13 From RF Design HQ It is time to make sure t...

THERMAL DESIGN EXPLORATION FOR THE OPEN COMPUTE PROJECT

By Tom GregoryThe Open Compute Project Foundation is tackling a big challenge...

General aspects on fan selection and layout

By Dr. Ing. Walter AngelisIntroduction and Description of Fan TypesSmall vent...

Thermal Resistance

INTRODUCTIONGenerally, the life of a device would decrease to half, and the f...

Estimating Natural Convection Heat Transfer Coefficient on a Flat Plate

Although most of the emphasis today in the electronics cooling community is d...

Thermal Characterization of IC Packages

Abstract: Thermal characterization of packages is critical for the performanc...

Thermal Analysis of PCB Mounted Small Outline Packages

Robert Day, Analog Devices and Prasad Tota, Mentor Graphics How thermal an...

Understanding dissipation, thermal resistance, and IC temperature (Part 2 of 2)

Thermal resistance: θJc measurement The test board is placed in the circul...